Edaps2018.org Website Review

THE IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization. This symposium consists of technical paper presentation, poster sessions, industry exhibits, workshops and tutorials. SERENITY AND A CITY are two diametrically opposite concepts, which however, get belied in the 'City Beautiful'. Chandigarh is a rare epitome of modernization co-existing with nature's preservation. It is here that the trees and plants are as much a part of the construction plans as the buildings and the roads. India's first planned city, is culturally vibrant and green city that is rightly called THE CITY BEAUTIFUL. EDAPS is sponsored by the IEEE EDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop, to be held during December 16-18 in Chandigarh. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform.